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1

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.76 MB

english, 2008

2

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 452 KB

english, 2007

3

Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.57 MB

english, 2007

4

Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Year:

2007

Language:

english

File:

PDF, 319 KB

english, 2007

5

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

Journal:

Applied Surface Science

Year:

2019

Language:

english

File:

PDF, 5.80 MB

english, 2019

6

Prevalence of pediculosis capitis among Korean children

Jeong-Min Oh, In Yong Lee, Won-Ja Lee, Min Seo, Sol-Ah Park, Seung Hyun Lee, Jang Hoon Seo, Tai-Soon Yong, Soon-Jung Park, Myeong Heon Shin, Ki-Soo Pai, Jae-Ran Yu, Seobo Sim

Journal:

Parasitology Research

Year:

2010

Language:

english

File:

PDF, 112 KB

english, 2010

7

Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee, Jong-Woong Kim, Dae-Up Kim, Jeong-Hoon Moon, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 378 KB

english, 2008

8

Retrospective Survey on Therapeutic Efficacy of Qigong in Korea

Lee, Myeong Soo, Hong, Sung-Soo, Lim, Hyun-Ja, Kim, Hye-Jung, Woo, Won-Hong, Moon, Sun-Rock

Journal:

The American Journal of Chinese Medicine

Year:

2003

Language:

english

File:

PDF, 686 KB

english, 2003

9

MRI of Vertebral Compression Fractures: Differentiation between Benign and Malignant Causes

Kim, Won Hong, Hur, Gham, Woo, Joung Joo, Cho, Wu Ho, Jung, Myeong Ja

Journal:

Journal of the Korean Radiological Society

Year:

1995

Language:

korean

File:

PDF, 3.90 MB

korean, 1995

10

Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2008

Language:

english

File:

PDF, 1000 KB

english, 2008

11

Reliability of nickel flip chip bumps with a tin–silver encapsulation on a copper/tin–silver substrate during the bonding process

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Sang-Su Ha, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 964 KB

english, 2007

12

Effect of Zn addition on mechanical properties of brass hollow spheres

Ja-Myeong Koo, Hideki Araki, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 568 KB

english, 2008

13

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 660 KB

english, 2008

14

Interfacial reactions between In–48Sn solder and electroless nickel/immersion gold substrate during reflow process

Ja-Myeong Koo, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Surface and Interface Analysis

Year:

2006

Language:

english

File:

PDF, 214 KB

english, 2006

15

Seminoma in undescended testis

Yun Jung Lim, Myeong Ja Jeong, Byung Noe Bae, Soung Hee Kim, Ji-Young Kim

Journal:

Abdominal Imaging

Year:

2008

Language:

english

File:

PDF, 290 KB

english, 2008

16

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.29 MB

english, 2004

17

Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 911 KB

english, 2005

18

Effect of substrate metallization on mechanical properties of Sn–3.5Ag BGA solder joints with multiple reflows

Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 768 KB

english, 2005

19

Friction welding of TiAl and AISI4140

Won-Bae Lee, Myoung-Gyun Kim, Ja-Myeong Koo, Kyoung-Kyun Kim, D. J. Quesnel, Young-Jig Kim, Seung-Boo Jung

Journal:

Journal of Materials Science

Year:

2004

Language:

english

File:

PDF, 305 KB

english, 2004

20

Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Scripta Materialia

Year:

2007

Language:

english

File:

PDF, 494 KB

english, 2007

21

Mel-18, a mammalian Polycomb gene, regulates angiogenic gene expression of endothelial cells

Ji-Hye Jung, Hyun-Jung Choi, Yong-Sun Maeng, Jung-Yeon Choi, Minhyung Kim, Ja-Young Kwon, Yong-Won Park, Young-Myeong Kim, Daehee Hwang, Young-Guen Kwon

Journal:

Biochemical and Biophysical Research Communications

Year:

2010

Language:

english

File:

PDF, 1.01 MB

english, 2010

22

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 2.84 MB

english, 2008

23

Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder

Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.50 MB

english, 2008

24

A pilot study of autologous CD34-depleted bone marrow mononuclear cell transplantation via the hepatic artery in five patients with liver failure

Park, Chung-Hwa, Bae, Si Hyun, Kim, Hee Yeon, Kim, Ja Kyung, Jung, Eun Sun, Chun, Ho Jong, Song, Myeong Jun, Lee, Sung-Eun, Cho, Seok Goo, Lee, Jong Wook, Choi, Jong Young, Yoon, Seung Kew, Han, Nam I

Journal:

Year:

2013

Language:

english

File:

PDF, 1.37 MB

english, 2013

25

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Lee, Jong-Bum, Koo, Ja-Myeong, Hong, Soon-Min, Shin, Hyoyoung, Moon, Young-jun, Jung, Jae-Pil, Yoo, Choong-Don, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 497 KB

english, 2008

26

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Lee, Jong-Bum, Koo, Ja-Myeong, Kim, Jong-Woong, Noh, Bo-In, Lee, Jong-Gun, Jung, Seung-Boo

Journal:

The Journal of Adhesion

Year:

2009

Language:

english

File:

PDF, 730 KB

english, 2009

27

Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Koo, Ja Myeong, Lee, Young Ho, Kim, Sun Kyu, Jeong, Myung Yong, Jung, Seung Boo

Journal:

Key Engineering Materials

Year:

2005

Language:

english

File:

PDF, 1.94 MB

english, 2005

28

[IEEE 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011 - Baltimore, MD, USA (2011.06.5-2011.06.10)] 2011 IEEE MTT-S International Microwave Symposium - Electrical characterization of differential stretchable transmission line

Jeon, Jae-Wan, Kim, Seong-Kyun, Koo, Ja-Myeong, Hong, Soon-Min, Moon, Young-Jun, Jung, Seung-Boo, Kim, Byung-Sung

Year:

2011

Language:

english

File:

PDF, 1.06 MB

english, 2011

29

External Qi Therapy to Treat Symptoms of Agent Orange Sequelae in Korean Combat Veterans of the Vietnam War

Lee, Myeong Soo, Woo, Won-Hong, Lim, Hyun-Ja, Hong, Sung-Soo, Kim, Hye-Jung, Moo, Sun-Rock

Journal:

The American Journal of Chinese Medicine

Year:

2004

Language:

english

File:

PDF, 122 KB

english, 2004

30

Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows

Koo, Ja Myeong, Jung, Seung Boo

Journal:

Advanced Materials Research

Year:

2007

Language:

english

File:

PDF, 3.70 MB

english, 2007

31

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Kim, Dae Gon, Kim, Jong Woong, Ha, Sang Su, Koo, Ja Myeong, Noh, Bo In, Jung, Seung Boo

Journal:

Materials Science Forum

Year:

2007

Language:

english

File:

PDF, 597 KB

english, 2007

32

Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows

Koo, Ja-Myeong, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

33

Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test

Koo, Ja Myeong, Kim, Dea Gon, Jung, Seung Boo

Journal:

Solid State Phenomena

Year:

2007

Language:

english

File:

PDF, 1.77 MB

english, 2007

34

A Comparative Evaluation of Friction-Welded and Brazed Ti and AISI 321 Stainless Steel Joints

Baek, Seung Wook, Lee, Won Bae, Koo, Ja Myeong, Lee, Chang Yong, Jung, Seung Boo

Journal:

Materials Science Forum

Year:

2008

Language:

english

File:

PDF, 1.72 MB

english, 2008

35

Mechanical Properties of Copper Hollow Sphere Manufactured by Sintering Process

Koo, Ja Myeong, Jung, Seung Boo

Journal:

Materials Science Forum

Year:

2006

Language:

english

File:

PDF, 574 KB

english, 2006

36

Mushrooms Collected from Deogyu Mountain, Muju, Korea and Their Antioxidant Activity

Kim, Seong-Eun, Lee, In-Kyoung, Jung, Yun-A, Yeom, Ji-Hee, Ki, Dae-Won, Lee, Myeong-Seok, Song, Ja-Gyeong, Jin, Yong-Ju, Seok, Soon-Ja, Yun, Bong-Sik

Journal:

Year:

2012

Language:

english

File:

PDF, 274 KB

english, 2012

37

Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film

Lee, Jong-Bum, Lee, Jong-Gun, Jo, Jung-Lae, Koo, Ja-Myeong, Chun, Chang-Keun, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 248 KB

english, 2009

38

Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding

Noh, Bo-In, Koo, Ja-Myeong, Jo, Jung-Lae, Jung, Seung-Boo

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 364 KB

english, 2008

39

Production of high-energy-density fuels by catalytic β-pinene dimerization: Effects of the catalyst surface acidity and pore width on selective dimer production

Jung, Ja Kyung, Lee, Yunsu, Choi, Jae-Wook, Jae, Jungho, Ha, Jeong-Myeong, Suh, Dong Jin, Choi, Jungkyu, Lee, Kwan-Young

Journal:

Energy Conversion and Management

Year:

2016

Language:

english

File:

PDF, 828 KB

english, 2016

40

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, Jong-Woong, Kim, Dae-Gon, Koo, Ja-Myeong, Yoon, Jeong-Won, Choi, Sunglak, Kim, Kyung-Sik, Nam, Jae-Do, Lee, Hoo-Jeong, Joo, Jinho, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2007

Language:

english

File:

PDF, 494 KB

english, 2007

41

Induction Brazing of γ-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film

Koo, Ja-Myeong, Lee, Won-Bae, Kim, Myoung-Gyun, Kim, Dae-Up, Kim, Young-Jig, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 298 KB

english, 2005

42

A Study on the prevalence and risk factors for varicose veins in nurses at a university hospital

Yun, Myeong-Ja, Kim, Young-Ki, Kang, Dong-Mug, Kim, Jong-Eun, Ha, Won-Choon, Jung, Kap-yeol, Choi, Hyun-Woo

Journal:

Safety and Health at Work

Year:

2017

Language:

english

File:

PDF, 829 KB

english, 2017

43

Cathodic electrophoretic deposition (EPD) of phenylenediamine-modified graphene oxide (GO) for anti-corrosion protection of metal surfaces

Hwang, Min-Ju, Kim, Myeong-Gi, Kim, Sanghoon, Kim, Ye Chan, Seo, Hee Won, Cho, Jung Keun, Park, In-Kyung, Suhr, Jonghwan, Moon, Hyungpil, Koo, Ja Choon, Choi, Hyouk Ryeol, Kim, Kwang Jin, Tak, Yongsug

Journal:

Year:

2018

Language:

english

File:

PDF, 7.55 MB

english, 2018

44

Plexiform Schwannoma of the Stomach in Neurofibromatosis Type 2: A Case Report

Yeom, Dong Heon, Cho, Hyun Sun, Kim, Hyun Jung, Cho, Woo Ho, Kim, Jae Hyung, Jeong, Myeong Ja, Kim, Soung Hee, Kim, Ji Young, Kim, Soo Hyun, Kang, Mi Jin, Lee, Jihae, Lee, Han Bee

Journal:

Journal of the Korean Society of Radiology

Year:

2012

Language:

english

File:

PDF, 1.39 MB

english, 2012

45

Slow Growing Desmoid-Type Fibromatosis of the Breast: A Case Report

Park, Ah Reum, Kim, Ji-Young, Kim, Hyun Jung, Kim, Jae Hyung, Jeong, Myeong Ja, Kim, Soung Hee, Kim, Soo Hyun, Kang, Mi Jin, Lee, Ji Hae, Bae, Kyung Eun

Journal:

Journal of the Korean Society of Radiology

Year:

2017

Language:

english

File:

PDF, 2.24 MB

english, 2017

46

Breast Metastasis from Renal Cell Carcinoma: A Case Report

Kim, Seon-Jeong, Kim, Ji-Young, Jeong, Myeong Ja, Kim, Jae Hyung, Kim, Soung Hee, Kim, Soo Hyun, Jun, Woo Sun, Kim, Hyun Jung, Han, Sehwan

Journal:

Journal of the Korean Society of Radiology

Year:

2010

Language:

korean

File:

PDF, 586 KB

korean, 2010

47

Histopathologic Findings Related to the Indeterminate or Inadequate Results of Fine-Needle Aspiration Biopsy and Correlation with Ultrasonographic Findings in Papillary Thyroid Carcinomas

Jung, So Lyung, Jung, Chan Kwon, Kim, Sung Hun, Kang, Bong Joo, Ahn, Kook Jin, Kim, Bum-soo, Ahn, Myeong Im, Im, Dong Jun, Bae, Ja Sung, Chung, Soo Kyo

Journal:

Korean Journal of Radiology

Year:

2010

Language:

english

File:

PDF, 511 KB

english, 2010

48

Antimicrobial Resistance and Molecular Characterization of Extended-Spectrum β-Lactamase-Producing Escherichia coli Isolated from Ducks in South Korea

Na, Seok Hyeon, Moon, Dong Chan, Choi, Myeong-Ja, Oh, Sun-Joo, Jung, Dae-Young, Sung, Eun Ji, Kang, Hee Young, Hyun, Bang-Hun, Lim, Suk-Kyung

Journal:

Foodborne Pathogens & Disease

Year:

2019

Language:

english

File:

PDF, 160 KB

english, 2019

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